- bumpless build-up layer
- (BBUL) <ic.prod> ■ Bumpless Build-Up-Layer m (BBUL)
English-german technical dictionary. 2013.
bumpless build-up layer
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Bumpless Build-up Layer — or BBUL is a processor packaging technology developed by Intel. It is bumpless, because it does not use the usual tiny solder bumps to attach the silicon die to the processor package wires. It has build up layers, because is grown / built up… … Wikipedia
